Electroplating apparatus

ABSTRACT

An electroplating apparatus is provided which includes a solution tank which has at least a bottom plate and a side plate and inside which electroplating solution is poured and a cathode plate and an anode plate which are horizontally placed so as to face each other in the electroplating solution in the solution tank, in which one plate of the cathode plate and the anode plate is an object to be electroplated and placed in a lower position than the other plate, in which an opening through which the cathode plate and the anode plate are inserted into the solution tank is provided in the side plate of the solution tank, and in which a shield plate which is detachable shields the opening of the solution tank.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the foreign priority benefit under Title 35,United States Code, §119(a)-(d) of Japanese Patent Application No.2005-125538, filed on Apr. 22, 2005 in the Japan Patent Office, thedisclosure of which is herein incorporated by reference in its entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an electroplating apparatus forperforming electroplating and anodic oxidation on surfaces of, forexample, wafers, glass substrates, and ceramic substrates.

2. Description of the Related Art

In recent years, electroplating technologies are applied to variouskinds of technical fields, including wiring technologies insemi-conductors. In the field of semi-conductors, wiring pitches arerequired to be reduced to accomplish high integration and performance.For example, in a wiring technology employed in latest years, aninterlayer insulated film is formed, and then dry etching process isperformed on the interlayer insulated film to form wiring grooves intowhich wiring material is electroplated and filled.

To achieve such an electroplating technology, it is required toelectroplate wiring material evenly in grooves which are formed on anobject to be electroplated. For this purpose, the applicant has proposedan electroplating apparatus which forms an even electroplating film on asurface to be electroplated of an object to be electroplated. (Refer toJP 2003-301299A, for example.)

In the above-mentioned electroplating apparatus, a cathode plate, whichis the object to be electroplated, and an anode plate are placed to faceeach other in a solution tank inside which electroplating solution ispoured. A power source is connected to the cathode plate and the anodeplate in order to generate electric field between the cathode plate andthe anode plate to electroplate a surface of the cathode plate.

By the way, in the electroplating apparatus described in JP2003-301299A, bubbles mainly composed of hydrogen are generated from thesurface to be electroplated of the cathode plate while the cathode plateis being electroplated. Then, the bubbles rise along the surface to beelectroplated of the cathode plate one after another since the cathodeplate, as well as the anode plate, is placed vertically in the solutiontank. Accordingly, a thickness of an electroplating film formed on thesurface to be electroplated of the cathode plate becomes uneven sincethe bubbles go along the surface to be electroplated of the cathodeplate. As a result, there is a problem that high quality of theelectroplating film cannot be always assured.

To solve such a problem, in a well-known method, an electroplatingapparatus is rotated by 90 degrees after a cathode plate and an anodeplate are installed vertically. Then, the cathode plate in a lowerposition and the anode plate in a higher position are held horizontallyto prevent bubbles from going directly along the surface of the cathodeplate. However, such a method requires another device to rotate theelectroplating apparatus. Accordingly, there is a problem that the wholeelectroplating apparatus becomes large and complicated.

SUMMARY OF THE INVENTION

In view of such a background, it is an object of the present inventionto provide an electroplating apparatus which is able to form anelectroplating film with an even thickness all over a surface to beelectroplated so as to improve quality of the electroplating film, aswell as to downsize and simplify the whole electroplating apparatus.

To solve the above-mentioned problem, in one aspect of the presentinvention, there is provided an electroplating apparatus including asolution tank which has at least a bottom plate and a side plate, andinside which electroplating solution is poured, and a cathode plate andan anode plate which are horizontally placed so as to face each other inthe electroplating solution in the solution tank. In the electroplatingapparatus, one plate of the cathode plate and the anode plate is anobject to be electroplated and placed in a lower position than the otherplate. In addition, an opening through which the cathode plate and theanode plate are inserted into the solution tank is provided in the sideplate of the solution tank. Furthermore, a shield plate which isdetachable shields the opening of the solution tank.

In such a configuration, when the cathode plate and the anode plate areinstalled, the cathode plate and the anode plate are inserted into thesolution tank through the opening provided in the side plate of thesolution tank. Accordingly, it is easy to install the cathode plate andthe anode plate horizontally and parallel each other in the solutiontank. In addition, the one plate of the cathode plate and the anodeplate, which is an object to be electroplated, is placed in the lowerposition than the other plate. Therefore, it is possible to let bubbleswhich are mainly composed of hydrogen and generated from a surface to beelectroplated of the one plate, go up directly to outside without goingalong the surface to be electroplated of the one plate. Moreover, it isalso easy to install the cathode plate and the anode plate horizontallyin the solution tank as described above. Consequently, a large scaledevice which rotates the whole solution tank by 90 degrees described inthe well-known method is not required. In the present invention, theobject to be electroplated may be connected to a negative electrode of apower source in order that the surface of the object to be electroplatedis electroplated. Moreover, the object to be electroplated may be alsoconnected to a positive electrode of the power source in order that ananodic film, which is an oxide film, is formed on the surface of theobject to be electroplated.

In the electroplating apparatus, a slot which holds the cathode plateand/or the anode plate horizontally may be provided in the side plate ofthe solution tank.

In such a configuration, it is required only to engage the cathode plateand/or the anode plate in the slot provided in the side plate of thesolution tank in order to hold the cathode plate and/or the anode platehorizontally in the solution tank. Accordingly, it is easy to installthe cathode plate and/or the anode plate.

In the electroplating apparatus, a plurality of the slots which hold thecathode plate and/or the anode plate horizontally may be verticallyarranged in the side plate of the solution tank in order to adjust aheight of the cathode plate and/or the anode plate.

In such a configuration, it is possible to change a verticalinstallation position of the cathode plate and/or the anode plate so asto change a distance between the cathode plate and the anode plate.Therefore, it is possible to properly control, for example, a thicknessof an electroplating film formed on the surface to be electroplated ofthe cathode plate (or the anode plate) which is the object to beelectroplated.

In the electroplating apparatus, the slots may be used to adjust aheight of the other plate. In addition, a conductive member whichconducts electricity to the other plate may be inserted downward fromabove toward inside of the solution tank into the other plate so as tobe electrically connected to the other plate. Moreover, the conductivemember may be supported in the solution tank in such a manner that aheight of the conductive member is adjustable corresponding to theheight of the other plate.

In such a configuration, the conductive member is inserted downward fromabove toward inside of the solution tank. Thus, an end of the conductivemember can be electrically connected to the other plate, which is placedin the higher of two positions of the cathode plate and the anode plate.Moreover, when the height of the other plate in the higher position ischanged, the height of the conductive member is adjusted correspondingto the height of the other plate in the higher position. Consequently,it is easy to engage and electrically connect the conductive member tothe other plate in the higher position.

In the electroplating apparatus, the one plate may be cantilevered andattached to the shield plate.

In such a configuration, to install the one plate, which is placed inthe lower of two positions of the cathode plate and the anode plate, theone plate is attached to the shield plate in advance and then installedin the solution tank. Accordingly, the one plate can be easilycantilevered and attached to the shield plate. Thus, a worker does notneed to bother to extend his/her hand into the opening of the solutiontank to install the one plate in the lower position. Moreover, toinstall the shield plate to the solution tank, only one edge of the oneplate in the lower position needs to be cantilevered. After the shieldplate has been installed in the solution tank, the other edge of the oneplate in the lower position can be, for example, hung on a portion ofthe solution tank which faces the shield plate or engaged in a slotformed in the solution tank so that both sides of the one plate can besupported. Therefore, the one plate in the lower position is stably heldin the solution tank. In addition, a bolt having a head may be attachedto the lower side of the other end of the one plate in the lowerposition in order to support the other end of the one plate with thehead of the bolt being touched on the bottom of the solution tank.

In the electroplating apparatus, a conductive member which conductselectricity to the one plate may pass through the shield platehorizontally toward inside of the solution tank so as to be electricallyconnected to the one plate.

In such a configuration, the conductive member passes through the shieldplate horizontally toward inside of the solution tank. Therefore, it iseasy to electrically connect the conductive member to the one plate,which is placed in the lower of two positions of the cathode plate andthe anode plate.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded perspective view showing an electroplatingapparatus according to an embodiment of the present invention.

FIG. 2 is an exploded perspective view showing the electroplatingapparatus with a cathode of FIG. 1 being attached to a shield plate.

FIG. 3 is a front view of a solution tank used in the embodiment of thepresent invention.

FIG. 4 is a left side view of the solution tank used in the embodimentof the present invention.

FIG. 5 is a left side view of the electroplating apparatus according tothe embodiment of the present invention.

FIG. 6 is a front view of the electroplating apparatus according to theembodiment of the present invention.

FIG. 7 is a front view of the electroplating apparatus from which theshield plate is detached.

FIG. 8 is an exploded perspective view showing an anode used in theembodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Next, an embodiment of the present invention will be described indetail, referring to the accompanied drawings as needed.

As shown in FIGS. 1-4, an electroplating apparatus 1 generally includesa solution tank 10, an anode 20, a cathode 30, and a shield plate 40.Electroplating solution is poured and filled inside the solution tank10.

As shown in FIGS. 1-4, the solution tank 10 has a bottom plate 10A, afirst side plate 10B as a front plate (hereafter referred as a sideplate 10B), a second side plate 10C as a back plate (hereafter referredas a side plate 10C), a third side plate 10D as a left side plate(hereafter referred as a side plate 10D), a fourth side plate 10E as aright side plate (hereafter referred as a side plate 10E), and a topplate 10F which is fastened to brackets 10B1 and 10C1 respectivelyprovided on upper ends of the side plates 10B and 10C, with bolts 11,11, 11, and 11 (see FIG. 2). Additionally, as shown in FIG. 3, a rightvertical plate 14 (hereafter referred as a vertical plate 14) erected onthe bottom plate 10A, a horizontal plate 13 extending horizontally froma lower portion of the vertical plate 14, and a left vertical plate 12(hereafter referred as a vertical plate 12) erected on a left end of thehorizontal plate 13 are formed inside the solution tank 10.

Moreover, a plurality of circulation holes 14A, 14A, . . . , and 14A(see FIG. 1) are cut through the vertical plate 14. In addition, aplurality of circulation holes 13A, 13A, . . . , and 13A are also cutthrough the horizontal plate 13. Furthermore, a drain hole 10A1 is cutthrough the bottom plate 10A. In addition, as shown in FIGS. 3 and 5, apump attachment opening 15 to which a pump (not shown) is to be attachedis cut through the side plate 10C of the solution tank 10 between theside plate 10E and the vertical plate 14. Moreover, a cover plate 16shown in FIG. 5 is placed between upper ends of the vertical plate 12and the vertical plate 14.

Therefore, when the pump is operated, electroplating solution is pouredfrom the pump in direction indicated by an arrow A as shown in FIG. 3.Then, the poured electroplating solution circulates in directionindicated by an arrow B through circulation holes 14A and in directionindicated by an arrow B′ over the top of the vertical plate 14, so as tobe poured into a space surrounded by the vertical plates 12 and 14 andthe horizontal plate 13. Moreover, the electroplating solution pouredinto the space circulates in direction indicated by an arrow C throughcirculation holes 13A and in direction indicated by an arrow D over thetop of the vertical plate 12, so as to be poured under the horizontalplate 13. Then, the electroplating solution is drained outside indirection indicated by an arrow F through the drain hole 10A1. Thus, thepump circulates the electroplating solution in predetermined directionin order to prevent the electroplating solution from staying. As aresult, the pump prevents “residues” which are generated while a wafer(a cathode plate) 31, which will be described later, is beingelectroplated, from sticking on the wafer 31.

Here, as shown in FIGS. 1-3, an opening 17 is formed in a substantiallytwo-tiered shape in the side plate 100B of the solution tank 10.Additionally, the opening 17 includes a narrow portion 17A which ishorizontally narrower and a wide portion 17B which is horizontally widerand connected to a lower side of the narrow portion 17A. Moreover, aplurality of slots 18A, 18A, . . . , and 18A are vertically arrangedalong right and left peripheries of the narrow portion 17A of theopening 17. Here, the slots are formed in substantially U-shapes, and apair of the slots face each other on the right and left peripheries. Inaddition, a plurality of slots 18B, 18B, . . . , and 18B which extendand elongate in horizontal direction are formed in the side plate 10C ofthe solution tank 10 at positions respectively corresponding to thepairs of the slots 18A, 18A, . . . , and 18A in the side plate 101B.Furthermore, a sealing member 19 formed as a substantially quadrangularframe is attached to the side plate 10B of the solution tank 10 so as tosurround the periphery of the opening 17. In addition, holding members51 and 51 which form parts of lock mechanisms 50 and 50 respectively arefixed and attached to a corner between the side plate 10B and the sideplate 10D and a corner between the side plate 10B and the side plate10E.

As shown in FIG. 8, the anode 20 includes an anode cartridge pan 21which is made of insulation material such as acrylic and formed in aquadrangular shape having a quadrangular recess 21A, an anode plate 22which is made of metallic material such as steel and nickel and formedin a quadrangular shape so as to fit in the recess 21A of the anodecartridge pan 21, an anode cartridge holder 23 which is made ofinsulating material such as acrylic in order to hold the anode plate 22between the anode cartridge holder 23 and the anode cartridge pans 21,an anode bag 24 which is made of fibrous material such as cloths andlined on a surface (a lower side in FIG. 8) of the anode cartridgeholder 23, and an anode bag holder 25 which is made of insulatingmaterial such as acrylic to hold the anode bag 24 between the anode bagholder 25 and the anode cartridge holder 23. By the way, it is possibleto change shape, size, and so on of an hole 25A formed in the anode bagholder 25 as needed depending on shape of a surface 31A to beelectroplated of the wafer 31.

Here, first engaging protrusions 23A and 23A formed in substantiallyquadrangular shapes are protruded on both sides of the front end of theanode cartridge holder 23. Moreover, a back end of the anode cartridgeholder 23 is a second engaging protrusion 23B which is protrudedbackward through between the anode cartridge pan 21 and the anode bagholder 25. Accordingly, as shown in FIGS. 5-7, the first engagingprotrusions 23A and 23A are engaged in the pair of the slots 18A and 18A(See FIG. 5) while the second engaging protrusion 23B (see FIG. 8) isengaged in the slot 18B. Thus, the anode 20 is installed. As a result,the anode 20 is horizontally and stably held by three points support inthe electroplating solution in the solution tank 10. By the way, theanode bag 24 prevents “residue”, which is generated while the wafer 31is being electroplated, from adhering to the anode plate 22.

Moreover, a conductive rod (a conductive member) 26 on an anode side isinserted from above into a circular hole 21B which is cut through theanode cartridge pan 21. Accordingly, an end (a lower end) of theconductive rod 26 on the anode side electrically contacts with the anodeplate 22. Then, the conductive rod 26 on the anode side is screwed intoa screw hole (not shown) which is cut through the cover plate 16. Thus,a worker can rotate the conductive rod 26 on the anode side in order toadjust the height of the end of the conductive rod 26 on the anode sidecorresponding to the height of the anode 20.

Structure of a cathode 30 is substantially similar to the cathodecartridge described in JP 2003-301299A. The cathode 30 is placedhorizontally and parallel to the anode 20 in a lower position than theanode 20. Moreover, the cathode 30 includes the wafer 31, which is anobject to be electroplated, a cathode conductor 32 which is a conductivemember to conduct electricity to the surface 31A of the wafer 31, afirst insulator 33 which is made of insulating material such as acryl tocover the frontside (the side of the surface 31A) of the wafer 31 andhold the cathode conductor 32, and a second insulator 34 which is madeof insulating material such as acryl to cover the backside (the oppositeside of the surface 31A) of the wafer 31 and hold the wafer 31.Moreover, the cathode conductor 32 includes a conductive ring plate 32Aand a conductive rod 32B on the cathode side which is electricallyconnected to the conductive ring plate 32A.

Additionally, as shown in FIG. 2, a front edge of the first insulator 33of the cathode 30 is fastened and attached to a shield plate 40, whichwill be described later, in the manner of a cantilever. Moreover, theconductive rod 32B of the cathode conductor 32 passes through the shieldplate 40 horizontally toward inside of the solution tank 10 to beelectrically connected to the wafer 31 through the conductive ring plate32A. As shown in FIGS. 1 and 2, insert holes 33A and 40A through whichthe conductive rod 32B is inserted are respectively provided in thefirst insulator 33 and the shield plate 40. Thus, the conductive rod 32Bprotrudes outside from the shield plate 40 through the insert holes 33Aand 40A. In addition, a cylindrical sealing member 70 (see FIG. 5)fluid-tightly seals between the conductive rod 32B and the insert hole33A and between the conductive rod 32B and the insert hole 40A.Therefore, the electroplating solution is prevented from leaking fromthe insert holes 33A and 40A. Moreover, ring sealing members (not shown)fluid-tightly seal between the wafer 31 and the first insulator 33 andbetween the first insulator 33 and the second insulator 34 respectively.

The shield plate 40, which is formed as a substantially quadrangularboard member, is affixed to an outer periphery of the sealing member 19to shield the opening 17. Moreover, a lever member 52 which forms a partof the lock mechanism 50 is provided on each of the right and left sidesof the shield plate 40 so as to be rotatable. Then, an end of the levermember 52 is latched to the holding member 51 so as to strongly pressthe shield plate 40 toward the sealing member 19. Accordingly, it ispossible to fluid-tightly seal the opening 17 with the shield plate 40and prevent the electroplating solution from leaking from the opening17.

The number “60” in FIG. 5 shows a mixing tool which is able to move backand forth on the upper end of the solution tank 10. As shown in FIGS.5-7, the mixing tool 60 generally includes a support plate 62 which hasrotatable rollers 61 and 61 on front and rear sides, vertical panels 63and 63 which vertically hang down from the support plate 62, and aconnecting rod 64 which connects the lower ends of the vertical panels63 and 63. In addition, an operation plate 65 which is operated fromoutside to move the mixing tool 60 back and forth is provided to thesupport plate 62. Moreover, in the mixing tool 60, an actuator (notshown) actuates the operation plate 65 to move back and forth so as tocause the vertical panels 63 and 63 and the connecting rod 64 to stirthe electroplating solution in order to prevent the electroplatingsolution from staying in the solution tank 10.

In such a configuration of the present embodiment, after the pump ispowered on, the conductive rod 26 on the anode side is connected to apositive electrode of a power source. In addition, the conductive rod32B on the cathode side is connected to a negative electrode of thepower source. Accordingly, an electroplating film is formed on thesurface 31A of the wafer 31 of the cathode 30.

Here, the cathode 30 in a lower position is placed horizontally andparallel to the anode 20 in a higher position. Therefore, it is possibleto let bubbles which are mainly composed of hydrogen and generated fromthe surface 31A of the wafer 31 of the cathode 30, go up from thesurface 31A of the wafer 31 to escape outside. Thus, the bubbles do notgo along the surface 31A of the wafer 31. As a result, it is possible toequalize the thickness of the electroplating film formed on all over thesurface to be electroplated to improve quality of the electroplatingfilm.

Moreover, the opening 17 through which the anode 20 and the cathode 30are inserted into the solution tank 10 is formed in the side plate 10Bof the solution tank 10. Accordingly, it is easy to insert the anode 20and the cathode 30 horizontally into the solution tank 10 through theopening 17. Thus, it is possible to easily install the anode 20 and thecathode 30 in the solution tank 10 so as to improve work efficiency ofinstalling the anode 20 and the cathode 30. Therefore, a large scaledevice which rotates the entire solution tank by 90 degrees as describedin the well-known method is not necessary. As a result, it is possibleto downsize and simplify the whole electroplating apparatus.

Moreover, the slots 18A are provided in the side plate 10B of thesolution tank 10. In addition, the slot 18B is provided in the sideplate 10C of the solution tank 10 at a height corresponding to the slots18A. Accordingly, the anode 20 is engaged in the slots 18A and 18B so asto be held horizontally in the solution tank 10. Thus, it is easy toinstall the anode 20.

Furthermore, the plurality of slots 18A, 18A, . . . , and 18A and theplurality of slots 18B, 18B, . . . , and 18B are respectively arrangedin the side plate 10B and the side plate 10C of the solution tank 10 invertical direction. Therefore, it is possible to change the installationposition of the anode 20 corresponding to the height of the slot 18A and18B in order to change a distance between the anode 20 and the cathode30. As a result, it is possible to appropriately control the thicknessof the electroplating film formed on the surface 31A of the wafer 31 ofthe cathode 30.

The conductive rod 26 is inserted downward from above toward inside ofthe solution tank 10 into the anode 20 which is placed in the higher oftwo positions of the anode 20 and the cathode 30, so as to beelectrically connected to the anode 20. In addition, the conductive rod26 is supported in the solution tank 10 in such a way that the height ofthe conductive rod 26 can be adjusted corresponding to the height of theanode 20. Therefore, it is easy to adjust the height of the conductiverod 26 depending on the height of the anode 20 in order to engage theconductive rod 26 in the anode plate 22.

Moreover, the cathode 30 is cantilevered and attached to the shieldplate 40. Therefore, to install the cathode 30, the shield plate 40 towhich the cathode 30 has been attached in advance, is installed into thesolution tank 10. Thus, the worker does not need to bother to extendhis/her hand into the opening 17 of the solution tank 10 to install thecathode 30. As a result, it is possible to easily install the cathode30.

Moreover, the conductive rod 32B of the cathode conductor 32 passesthrough the shield plate 40 horizontally so as to be electricallyconnected to the cathode 30 which is placed in the lower of twopositions of the anode 20 and the cathode 30. Therefore, it is easy toelectrically connect the conductive rod 32B to the wafer 31 of thecathode 30 through the conductive ring plate 32A.

In the present embodiment, description has been given to an examplewhere the anode 20 is installed in the solution tank 10 in such a waythat the height of the anode 20 can be changed and the cathode 30 isattached to the shield plate 40. However, the present invention is notlimited to this. For example, the anode 20 may be attached to the shieldplate 40, and the cathode 30 may be installed in the solution tank 10 insuch a way that the height of the cathode 30 can be changed. Moreover,an anode plate may be an object to be electroplated and placed in alower position than a cathode plate. In this case, an anodic film, whichis an oxide film, may be formed on a surface of the anode plate.

Moreover, in the present embodiment, description has been given to anexample where only the ring sealing members (not shown) are used tofluid-tightly seal between the wafer 31 and the first insulator 33 andbetween the first insulator 33 and the second insulator 34 respectively.However, the present invention is not limited to this. For example, airpressure of the back side of the wafer 31 can be made and kept negativeusing a pump (not shown) or the like in order to affix the whole wafer31 on a surface of the ring sealing member with even pressure so as toimprove the sealing performance of the ring sealing member. In thiscase, the sealing member 70 also has a function to prevent a problemthat the electroplating solution infiltrates into a portion other thanthe surface 31A of the wafer 31 in combination with the ring sealingmembers.

Furthermore, as shown in FIG. 5, in the present embodiment, descriptionhas been given to an example where the connecting rod 64 of the mixingtool 60 is formed as a round rod. However, the present invention is notlimited to this. For example, the cross section of the connecting rod 64of the mixing tool 60 may be formed in a quadrangle, a triangle, orother shape.

According to the present invention, a thickness of an electroplatingfilm formed on a surface to be electroplated of an object to beelectroplated can be equalized all over the surface so as to improvequality of the electroplating film. In addition, it is easy to install acathode plate and an anode plate horizontally inside a solution tankthrough an opening provided in a side plate of the solution tank so asto improve work efficiency of installing the plates. Moreover, a largescale device which rotates the solution tank by 90 degrees is notrequired. As a result, a whole electroplating apparatus is possible tobe downsized and simplified.

While the described embodiments represent the preferred forms of thepresent invention, it is to be distinctly understood that the inventionis not limited thereto but may be otherwise variously embodied withinthe spirit and scope of the following claims.

1. An electroplating apparatus, comprising: a solution tank which has atleast a bottom plate and a side plate and inside which electroplatingsolution is poured; and a cathode plate and an anode plate which arehorizontally placed so as to face each other in the electroplatingsolution in the solution tank, wherein one plate of the cathode plateand the anode plate is an object to be electroplated and placed in alower position than the other plate, wherein an opening through whichthe cathode plate and the anode plate are inserted into the solutiontank is provided in the side plate of the solution tank, and wherein ashield plate which is detachable shields the opening of the solutiontank.
 2. An electroplating apparatus according to claim 1, wherein aslot which holds the cathode plate and/or the anode plate horizontallyis provided in the side plate of the solution tank.
 3. An electroplatingapparatus according to claim 1, wherein a plurality of slots which holdthe cathode plate and/or the anode plate horizontally are verticallyarranged in the side plate of the solution tank in order to adjust aheight of the cathode plate and/or the anode plate.
 4. An electroplatingapparatus according to claim 3, wherein the slots are used to adjust aheight of the other plate, wherein a conductive member which conductselectricity to the other plate is inserted downward from above towardinside of the solution tank into the other plate so as to beelectrically connected to the other plate, and wherein the conductivemember is supported in the solution tank in such a manner that a heightof the conductive member is adjustable corresponding to the height ofthe other plate.
 5. An electroplating apparatus according to claim 4,wherein the one plate is cantilevered and attached to the shield plate.6. An electroplating apparatus according to claim 5, wherein aconductive member which conducts electricity to the one plate passesthrough the shield plate horizontally toward inside of the solution tankso as to be electrically connected to the one plate.